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NTMS5P02, NVMS5P02
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 m W )
Gate ? to ? Source Voltage ? Continuous
Thermal Resistance ?
Junction ? to ? Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Thermal Resistance ?
Junction ? to ? Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Thermal Resistance ?
Junction ? to ? Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche Energy ? Starting T J = 25 ° C
(V DD = ? 20 Vdc, V GS = ? 5.0 Vdc, Peak I L = ? 8.5 Apk, L = 10 mH, R G = 25 W )
Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from case for 10 seconds
Symbol
V DSS
V DGR
V GS
R q JA
P D
I D
I D
P D
I D
I DM
R q JA
P D
I D
I D
P D
I D
I DM
R q JA
P D
I D
I D
P D
I D
I DM
T J , T stg
E AS
T L
Value
? 20
? 20
± 10
50
2.5
? 7.05
? 5.62
1.2
? 4.85
? 28
85
1.47
? 5.40
? 4.30
0.7
? 3.72
? 20
159
0.79
? 3.95
? 3.15
0.38
? 2.75
? 12
? 55 to +150
360
260
Unit
V
V
V
° C/W
W
A
A
W
A
A
° C/W
W
A
A
W
A
A
° C/W
W
A
A
W
A
A
° C
mJ
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Mounted onto a 2 ″ square FR ? 4 Board (1 ″ sq. 2 oz Cu 0.06 ″ thick single sided), t ≤ 10 seconds.
2. Mounted onto a 2 ″ square FR ? 4 Board (1 ″ sq. 2 oz Cu 0.06 ″ thick single sided), t = steady state.
3. Minimum FR ? 4 or G ? 10 PCB, t = Steady State.
4. Pulse Test: Pulse Width = 300 m s, Duty Cycle = 2%.
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